Hui Zhang, Ph.D., is a Lecturer and Master’s Supervisor at the School of Electrical Engineering, Henan University of Technology. He received his Doctorate in Engineering from Harbin Institute of Technology in 2021. Dr. Zhang has long been engaged in research related to motion planning for redundant manipulators under environmental constraints, coordinated motion planning for dual-arm robots, intelligent interaction technologies in human-robot collaboration, intelligent inspection of aerospace components, and digital twin technologies. He has presided over one National Natural Science Foundation of China (NSFC) Youth Project and four provincial-level scientific research projects. Additionally, he has participated in several major initiatives, including a National Key R&D Program project, a corresponding provincial-level R&D support project, another NSFC project, a project under the State Key Laboratory of Robotics Technology and Systems, a teaching reform project for higher education in Henan, and a Henan provincial graduate-level teaching case project.
Dr. Zhang has published more than ten academic papers in top-tier international journals and conferences, such as IEEE Transactions on Industrial Informatics, IEEE/ASME Transactions on Mechatronics, ISA Transactions, Nonlinear Dynamics, and the International Conference on Robotics and Automation (ICRA). He has authored one academic monograph funded by the National Publication Foundation for Academic Works (established by the State Council) and contributed to one provincial-level textbook. He holds five national patents and three software copyrights. His research outcomes have been appraised by the Henan Instrument and Control Society.
Dr. Zhang’s research focuses on robotic interaction, human-robot integration, motion planning, digital twin technologies, and intelligent detection, including: (1) Motion planning for robotic manipulators and dual-arm coordination; (2) Intelligent control and interaction under human-robot collaboration scenarios; (3) Intelligent inspection technologies for aerospace-specific components; (4) Embedded intelligent systems development based on microcontrollers; (5) 3D vision point cloud feature extraction and reconstruction.
